MEMS and Sensors
- 3D MEMS
- CMOS-compatible MEMS
- Context awareness
- E-field sensor
- Gesture recognition
- Haptics
- Image sensors
- Indoor/pedestrian navigation
- Inertial Measurement Units
- Lightning detector
- MEMS adoption
- MEMS design tools
- MEMS testing
- Microphones
- Micro-windmills
- Motion sensing
- Oscillators
- OSes and Sensors
- Pico-projectors
- Sensor fusion
- Sensor hubs
- Sensor management
- Sensor networks
- Sensor standards
- Smartphone sensors
- Stylus technology
- Touch technology
- Tunable RF filters/antennae
- Various specialized sensors
- Wireless sensors
EDA
- Analog chip design
- Architecture modeling
- Assertion synthesis
- Asynchronous design
- Chip verification
- Clock design
- Cloud computing
- Debug
- Design closure
- Design management
- Design quality
- DFM
- Digital chip design
- DRC
- ECOs
- Emulation
- Formal verification
- IP block verification
- MEMS
- Optical design
- Power reduction
- Power verification
- Reverse engineering
- TCAD
- Virtual platforms
FPGAs
- Embedded OS
- High-speed interconnect
- Incremental design
- Power
- Prototyping
Internet of Things
- Sensors
- Communications protocols
- Security
- AI/Machine learning
Energy
- Energy harvesting
- Power over Ethernet
- Printable batteries
- Prototype boards
- RTL sign-off
- Smart grid
- Smart meters
- Solid-state lithium batteries
- Wireless power
Embedded systems
- Agile programming
- ATCA
- B# programming language
- Computational photography
- CPU benchmarking
- Debug
- Deep packet inspection
- DSPs
- Embedded web servers
- Flow processing
- Green plugs
- In-memory databases
- Network processors
- Networks on chip
- OSes
- Packet processing
- Powerline communication
- Processor benchmarks
- Requirements traceability
- Software license management
- Safety-critical software standards
- Web/app servers
Multicore
- AMP
- Architectures
- Many-core processors
- MCAPI (multicore communication mgmt std)
- MRAPI (multicore resource mgmt std.)
- Multicore automation
- Partitioning/parallelization
- SHIM
IP
- ARM cores
- DSP
- ECC
- General purpose processors
- Quality
- Audio
Semiconductors and technology
- 28-, 20-, 14-, 10-, 7-nm technology
- 3D ICs
- Advanced lithography
- Black silicon
- Carbon nano-tubes
- CMOS-compatible MEMS
- DFT
- Directed self-assembly
- Double-patterning
- E-beam lithography
- EUV (Extreme UV)
- Exotic materials
- FD-SOI
- Fin-FETs
- Flexible silicon
- Gate-first/gate-last
- Graphene
- Inspection
- Interposers
- JTAG
- “Junctionless” transistors
- LEDs
- Local interconnect
- Metatronics
- Metrology
- MRAMs
- N-epi
- Non-volatile memory
- Organic semiconductors
- Physically Unclonable Functions
- Quantum dots
- SADP
- Silicon on Sapphire
- Stretchable circuits
- Superconductors
- Sustainable design
- Thermal management
- Triple-patterning
- Variation
- Wafer inspection
- Wide-bandgap materials
- WSe2 transistors
- Yield improvement
Other
- Advanced PWBs
- Board-level ESD
- CNT-infused wiring
- Lens-free imaging
- Medical imaging
- Memristors
- MIMO testing
- Net neutrality
- Packaging
- Research lab equipment
- RFIDs
- Sustainable electronics
- SEU-tolerant circuits
- Super-capacitors